Abstract

Thermal stability of DNA: RNA duplex formation of disulphide bond containing oligodeoxynucleotide was studied using UV thermal melting (T_m). The disulphide bond containing oligodeoxynucleotide increased the melting temperature of DNA:RNA duplex by 9.5 ^oC to duplex containing unmodified oligodeoxynucleotide. The DNA: RNA duplex stability of disulphide bond containing oligodeoxynucleotide was also enhanced by 3 ^oC relative to duplex containing C-5 propyne deoxyuridine substituted oligodeoxynucleotide.

Keywords

C-5 Thiopropyne thymidine substituted oligodeoxynucleotides, T_m, C-5 propynedeo-xyuridine oligodeoxynucleotide, Disulphide bond containing oligonucleotide.