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  • Chem Sci Trans., 2014, 3(3),  pp 1214-1220  

    DOI:10.7598/cst2014.848

    Research Article

    Electroless Copper Deposition Using Saccharose Containing Copper Methane Sulphonate Bath with Thiourea as Stabilizer

  • P. BALARAMESH1, S. REKHA2, P. VENKATESH3 and S.SHANMUGAN4*
  • 1RMK Engineering College, RSM Nagar, Kavaraipettai, Chennai, Tamilnadu, India
    2RMD Engineering College, RSM Nagar, Kavaraipettai, Chennai, Tamilnadu, India
    3Pachayaippa’s College, Chennai, Tamilnadu, India
    4Nano Optoelectronics Research Laboratory, School of Physics, Universiti Sains, Malaysia (USM), 11800, Minden, Pulau Pinang, Malaysia
  • Abstract

    Electroless copper deposition is used in the fabrication of integrated circuit (IC) interconnections, micro-electro-mechanical systems (MEMS) devices and printed circuit board (PCBs). In order to meet the long term usage of chemical bath for electroless deposition, an eco-friendly copper methane sulphonate (CuMS) was used to prepare the chemical bath for Cu deposit. The deposition parameters such as temperature, pH, Cu ion concentration and para-formaldehyde concentration were optimized at 28 oC with 3 g/L of CuMS, 10 g/L of para-formaldehyde for the pH of 12.75. The deposition rate was increased for high concentration of Cu and para-formaldehyde in the chemical bath. Highly stable bath was achieved at 28 oC with 1 ppm thiourea content and produced uniform Cu film surface with larger grains. Good quality and (200) oriented Cu thin film with larger crystallite size was observed with 1 ppm thiourea added bath.

    Keywords

    Electroless deposition. Copper methane sulphonate, Stable bath, Saccharose, Thiourea

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